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Spot Soldering Process
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Exselect’s spot soldering system a patented, award winning technology is used to selectively solder specific components on a partially assembled, surface-mount printed circuit board or assembly.
Utilizing a static solder pot (no pumps), the solder pocket plate is submerged in the solder until the board is in position for processing. Prior to the soldering process, a wiper assembly moves back and forth across the surface of the solder moving any dross to the sides of the pot. Once clean the solder pocket plate emerges from the solder, collecting solder in the pockets designed specifically for the application. When the board is in position it lowers down and makes contact with the solder plate and pockets. After the soldering is complete, the board retracts and the solder plate is again submerged back into the solder.
Pinpointer 18
Pinpointer 86
Pinpointer 88
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Fountain
Mini-Wave Process
Maximum Flexibility
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Molten
solder is pumped upwards through a fountain shaped nozzle to the soldering
joint. The overflow is directed back down into the solder bath along all sides
of the nozzle. The resulting contact surface of solder corresponds to the
dimensions of the individual solder joint.
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EO82-Offline Mini-Wave System
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Rework Station
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Dip Rite Solder and Desolder system |
